Anton Shilov / Tom's Hardware:

Amkor and TSMC sign an MOU to collaborate on advanced chip packaging for AI, HPC, PC, and mobile processors at Amkor's planned ~$2B facility in Peoria, Arizona  —  Apple and Nvidia rejoice.  —  When Amkor announced plans to build a $1.6 billion chip test and packaging facility near Peoria …

Anton Shilov / Tom's Hardware:

Amkor and TSMC sign an MOU to collaborate on advanced chip packaging for AI, HPC, PC, and mobile processors at Amkor's planned ~$2B facility in Peoria, Arizona  —  Apple and Nvidia rejoice.  —  When Amkor announced plans to build a $1.6 billion chip test and packaging facility near Peoria …

Source: TechMeme
Source Link: http://www.techmeme.com/241006/p1#a241006p1